Capabilities
Below are our detailed PCB manufacturing capabilities.
Materials
FR4
Polyimide
Flexible
Metal cored
Metal backed
Halogen free
+ Other specialist materials available on request
Dimensions
Maximum active board size: 992x992mm
Maximum board length for metal backed: 1200mm
Driling
Minimum drill size (Mechanical): 0.15mm
Maximum drill size: 6.35mm
Apsect Ratio: 12:1
PTH Diameter Tolerance: +/- 0.075mm
Minimum slot width: 0.45mm
Board Construction
Maximum layer count: 24
Maximum thickness: 6.0mm
Thickness tolerances: +/- 10%
Minimum core thickness: 0.05mm
Buried/Blind vias: Sequential builds or depth mechanical drill laser drilled (0.1mm)
Layers
Inner layers
Minimum annular ring (Copper weight dependent): 0.004″
0.50oz: 0.0025″ / 0.0025
1.00oz: 0.0035″ / 0.0028
2.00oz: 0.005″ / 0.003
3.00oz: 0.006″ / 0.0035
Copper weights available: 1oz to 6oz
Outer layers
Minimum annular ring (Copper weight dependent): 0.004″
0.25oz: 0.003″
0.50oz: 0.003″
1.00oz: 0.005″
2.00oz: 0.006″
Copper weights available: 1oz to 14oz
Test Capabilities
Minimum SMD width: 0.006″
Minimum SMD pitch: 0.010″
Maximum test voltage: 500V
Maximum insulation resistance: 250MΩ
Minimum conductive resistance: 5Ω
Resist / Legend
Resist / ident colour: Red, Blue, Green, Black, White, Yellow, Purple (Others available on request)
Minimum clearance: 0.004″
Minimum dam: 0.004″
Minimum text width on ident: 0.005″
Finishes
OSP
Pb Free HAL
Immersion Gold
Electrolytic Gold
Immersion Tin
Carbon Tin
Carbon Ink
Immersion Silver
Combination of the above
Rout / Score
Rout position tolerance: +/- 0.10mm
Scoring position tolerance: +/- 0.15mm
Bevelling
Countersink plated or unplated
Counterbore plated or unplated
Depth milling tolerance: +/- 0.15mm
Minimum router diameter: 0.6mm
IMS
Dielectric types: Many available, please ask
Dielectric thickness: 0.004″, 0.006″, 0.010″, 0.012″
Metal substrates: Copper, Aluminium
Metal substrate thickness: 0.4, 0.8, 1.0, 1.2, 1.55, 2.0, 3.0, 4.0 (also metal cored with PTH)
If you require something not on the list, please ask!
